A series of light-emitting elements that achieve high quality and durability while reducing the risk of quality accidents.
With approximately 300 million delivery records and zero external complaints, we introduce a series of light-emitting devices that you can use with confidence.
This is a series of ultra-thin light-emitting devices that are among the thinnest in the industry. It features three main characteristics, achieving high quality, durability, and reliability. 1. Use of a palladium-plated frame for high durability Typically, solder plating is done after the product is completed, but post-plating can lead to the intrusion of plating solution, resulting in quality issues. Our products use pre-plating, eliminating this risk. 2. Low-temperature assembly prevents quality degradation due to material oxidation By utilizing low-temperature rapid curing die bonding, we achieve high adhesion between the chip, frame, and resin. Additionally, the high bonding quality due to oxidation prevention of the frame and reduction of impurities ensures no quality degradation from material oxidation. 3. Adoption of highly reliable resin/structure We prevent quality degradation with highly reliable molded resin, void-free molding under reduced pressure, and a double-structured package that prevents deterioration. *If you have any concerns, please feel free to contact us.
- Company:島田電子工業
- Price:Less than 10,000 yen